Trade shows
INDPACK-2011, Ecobliss India Pvt exhibits at the National Three-Day Packaging Exhibition held in Hyderabad on November 24th-26th 2011
Packaging For Tomorrow
The Indian Institute of Packaging, a 45 year old autonomous body in Packaging Technology under the Ministry of Commerce & Industry, Government of India announced the 14th edition of INDPACK-2011, the National Three-Day Packaging Exhibition with a theme of Packaging For Tomorrow to be held on November 24th-26th, 2011 at Hyderabad International Convention centre, Hyderabad.
After the successes of previous editions of Indpack it has grown as a brand name in Indian Packaging industry and world over. Recognizing that the new trends and development are essential to the industry’s bright future, the Indian Institute of Packaging, through Indpack, seeks to provide a perfect platform to bring the packaging industry under one roof.
With the support from Ministry of Commerce & Industry, Ministry of Food Processing Industry, Ministry of Textiles, Govt of India and many Trade Associations, from India and abroad including World Packaging Organization and Asian Packaging Federation, Indpack is all set to continue the success story in 2011 edition.
The Exhibition is supported by The Ministry of Commerce & Industry and The Ministry of Food Processing Industries, Govt of India and will be inaugurated by the Chief Guest, Mr. Rakesh Kacker, I.A.S., Secretary – Ministry of Food Processing Industries, Mr. Ajit singh, Chairman, ACG worldwide is the Guest of Honour.
A curtain raiser launch of the event was held at Bengaluru presided by, Prof N.C.Saha, Director, IIP alongwith him the other luminaries from the industry such as Mr. Diwakar Shetty, Vice chairman-IIP, Mr. A.V.P.S. Chakravarthi, Chairman-IIP Hyderabad, Mr. P. Dasgupta, Chairman- National Conference and Dr. B.K. Karna, Head, IIP, Hyderabad were present.
Coinciding w
ith this exhibition, the Institute is also organising The National Packaging Conference on “Modern Trends in Packaging of Food and Pharmaceutical Products” which will be held at HICC, Hyderabad during November 25 & 26, 2011.
Sixteen technical sessions will be covered during this one and half day conference by the eminent speakers from India and abroad. Over 250 delegates comprising of packaging raw material manufacturers, converters, packaging machinery suppliers and packaging user industries would be participating in this national conference.
INDPACK 2011 will showcase innovative packaging materials, technologies, systems and machineries bringing together all the stakeholders who are directly or indirectly related to packaging business into a single platform and share knowledge and information on the latest trends and technologies of packaging. Till date, over 100 exhibitors from the MSME sectors of South India have confirmed participation, more are expected. It is estimated to attract over 5000-6000 visitors from across the country.
Istanbul International Packaging Fair 2011 (15-18 September 2011)
Visit Ecobliss Blisterproducts – Hall 8 – stand 811 E
As the largest trade show of the packaging industry in the region, Eurasia Packaging 2011 Istanbul will lead the industry.
As a marketing platform where the competitive strength, technological developments, product volumes and newest designs in the packaging industry are displayed, the Eurasia Packaging Fair has become a sought-after event in the domestic market as well.
The increase in the number of foreign visitors to the Packaging Fair in September 2010 was an advantage to participants making new connections in new markets. The Packaging Fair received 4105 visitors from 70 countries including Egypt, FYRO Macedonia, Russia, Ukraine, Bulgaria, Georgia, Iran, Syria, Israel, Kuwait, Azerbaijan, Armenia, the Turkish Republic of Northern Cyprus, Greece, Croatia and Moldova, in addition to 38,071 professional visitors from 74 provinces of Turkey and delegation members appointed by the chambers of commerce and industry of their respective cities.
INDIAPACK 2010 – A report
The trade fair INDIAPACK (along with Food Tech show) was organized during September 30 – October 3, 2010 at Bombay Exhibition Center, Mumbai, India has received an overwhelming response from the industry with over 12,142 trade visitors witnessing the fairs.
The event was inaugurated by Mr. Ashok Sinha, IAS, Secretary, Ministry of Food Processing Industries, Govt. of India on September 30, 2010 with other dignitaries including Mr Keith Pearson, President, World Packaging Organization.
“MrAshok Sinha, IAS, Secretary, Ministry of Food Processing Industries,Govt of India in his inaugural address outlined the importance of Food Processing sector and the packaging sector in the overall growth and development of the economy in the country. He also assured the active support and involvement of his ministry for the next editions of this show”.
“In his address Mr Keith Pearson, President,World Packaging Organization mentioned that the Indian Packaging industry has been growing in the recent past and the future also looks bright.
Indian Institute of packaging has been very actively involved in the development of packaging sector in India. The exhibition would be an ideal platform for all the packaging and related fraternity to see for them what India has to offer to the global market in these sectors”.
“Mr Sanjay Bhatia, Chairman, Indian Institute of Packaging in his keynote address mentioned the role of Institute in development of the packaging sector in the country. This event will provide an opportunity for the Indian packaging and food processing industry to not only highlight its potential but also enable it to exchange and learn from international participants present in large numbers at this event”.
Mr N C Saha, Director, Indian Institute of Packaging in his welcome address sincerely conveyed his thanks to packaging and allied sectors in India and abroad for bestowing there confidence towards the institute.
INDIAPACK 2010 HIGHLIGHTS:
- Gross Area Covered: 19,143sq. mts.
- Exhibitors: 366 (Including Intl. Foodtec & Asia Coat & Ink Show)
- International Representation: Over 25 countries worldwide
- Visitors: 12,142 Trade Visitors including 500 International visitors
- Country Pavilions: Germany, France, China, Taiwan, Sweden
- International Participation from Belgium, Denmark, Finland, India, Italy, Japan, Korea, Latvia, Lithuania, Malaysia, Poland, Singapore, Spain, Switzerland, Taiwan, Thailand, The Netherlands, Turkey, UAE, UK, USA
- Recycling Pavilion: Initiative by IIP, Plastindia Foundation & ICPE with an objective to educate & disseminate information to the trade visitors about creating wealth from waste, Recycling Pavilion was set up to display how the plastic scrap can be converted to usable plastic and its products.
- Awards for packaging excellence, INDIASTARS were presented to host of Industries during a grand gala function.
Ecobliss’s Stall at Indiapack was the most attractive one with over 15000 footfalls in its booth. It launched host of Blister packaging opportunities useful for various user segments, practically demonstrated at the booth as well. Mr. Ron Linssen,Chairman of Ecobliss group not only was personally present at the booth but addressed various technical queries from the visitors. Incidentally he chaired one of the sessions on latest trends worldwide on packaging machinery at the International Summit for Packaging Industry.
ProPak Indonesia Back On Track! 1 – 4 December 2010
The 23rd International Series of Exhibitions for the Processing, Packaging and End- Line Printing Industries. Indonesia’s established international trade show for the packaging and processing sectors in South East Asia’s biggest market.
Supported by The Indonesian Packaging Federation, The Indonesian Food & Beverages Association, The Indonesian Woven Polyolefin Manufacturers Association and The Indonesian Master Printers Association.
On the back of a sold out event in 2009 and positive market projections for 2010, ProPak Indonesia 2010 returns 1-4 December 2010 as the country’s longest running processing and packaging event. Taking place as an integral part of Manufacturing Indonesia 2010, Indonesia’s most important industrial trade event, ProPak Indonesia 2010 now in its 23rd edition, is set to provide a focus for the processed foods market growing by over 10% pa and a packaging market valued at over US$125 million.
2010 Positive Economic Forecasts
The Indonesian economy is expected to grow moderately by 5.2% in 2010, better than any neighboring ASEAN economies. A large domestic market with an emerging middle class and relatively young population whose consumption accounts for 60% of GDP will help drive healthy and solid growth going forward. This is underpinned by relatively low inflation and increased consumer
bank financing activities. Similarly, foreign direct investment activities are set to rise in tandem with Indonesia’s positive economic growth prospects and stable political scene following the recent legislative and presidential elections. Within South East Asia, analysts have indicated that Indonesia is where they would put their money and that Indonesia’s growth will have a stronger footing than its neighbors.
JAKARTA INTERNATIONAL EXPO, KEMAYORAN, JAKARTA, INDONESIA
Indiapack 2010 held from September 30th until October 3th 2010
Bombay Exhibition Centre – Mumbai, India
After the successes of previous three edition of Indiapack it has grown as a brand name in Indian Packaging industry and world over. Recognizing that the new trends and development are essential to the industry’s bright future, the Indian Institute of Packaging, through Indiapack, seeks to provide a perfect platform to bring the packaging industry under one roof. With this the industry has opportunity to connect at this highly specialized event where the issues of meeting the soaring demand for more sophisticated packaging together with the ever present need for increased productivity are addressed.
With the support from Ministry of Commerce & Industry, Ministry of Food Processing Industry, Ministry of Textiles, Govt of India and many Trade Association, from India and abroad including World Packaging Organization and Asian Packaging Federation, Indiapack is all set to continue the success story in 2010 edition.
Indian Packaging industry with a growth of more than 15% p.a. accounts for USD 14 Billion. This shows the immense potential in the industry. This growth is expected to be doubled in next two years and figures indicate towards a change in the industrial and consumer set up. Packaging today, has grown in importance and is regarded as vital marketing tool. It enhances product value and helps expand market within and outside country. The packaging industry can be characterized as global and fast growing industry.
With a rapid growth in markets like Food, beverage, pharmaceutical, cosmetics and textile has provided momentum for the need of packaging as all these sectors need specialized packaging. Availability of most of the raw material in abundance that is required in packaging industry such as paper, plastic, board, glass, metal adds to the further growth of industry
International FoodTec 2010- International exhibition on food processing & packaging technology, equipments and supplies. At the same time the other concurrent events viz. a high level International Packaging Conference & the National Awards for Excellence in Packaging will be organized by Indian Institute of Packaging.
Emballage 2010, Paris 22-25 November
THE EXHIBITION showcasing packaging innovation. A unique event to boost your new products!
In 2010, Paris: The place to be!
EMBALLAGE 2010 will prioritize innovation and sustainable development, and give you clues to packing “smart”!
EMBALLAGE 2010 will be staged in 3 halls at Paris Nord Villepinte from Monday 22 to Thursday 25 November 2010 and gathers all the industry players for several days of exchanges, demonstrations, presentations… 
Created in 1947, EMBALLAGE, the international Packaging Exhibition, has established itself as the key event of the pac
kaging-related industries in the EMEA area (Europe – Middle East – Africa).
All Pack Indonesia packaging exhibition in Jakarta, Nov 11-14, 2009
The All Pack Indonesia packaging exhibition is celebrating its 10th anniversary. As a visitor you will find Packaging Machinery, Materials System and Supplies, Food & Beverage Processing & Packaging, Pharma Processing & Packaging, Bottling, Plastics, Refrigeration, Automation, Material Handling, Quality Control and Testing systems
Place : Jakarta International Expo; Hall A,B and C
Ecobliss will introduce its cold seal packaging technology to the Indonesian market. Do not miss the opportunity to visit us at booth number K110
Istanbul October 22-25 th. What a packaging Exhibition!
The 2009 (15th) İstanbul Packaging Industry Fair counted around 1200 companies that participated and company representatives from more than 40 countries at 60.000 square meters indoor area in 9 halls. More than 35.000 visitors where welcomed at Istanbul Packaging 2009.
For the first time since the first Introduction of Ecobliss in Turkey, Ecobliss Embalaj introduced their blisterpackaging program in a big way. Many customers where attracted to the booth of Ecobliss by invitations, handed out in the aisles of the exhibition floor, to collect at the booth of Ecobliss a small gift, a Nazar Boncuğu.
Nazar Boncuğu: Many Turkish people believe that with the evil eye amulet you will be protected and all the bad energy will be directed to the amulet and it will brake. No bad energy will reach you since you are protected with the amulet of nazar boncuk. Have you just had a new child? Bought a new car? Built a new office building? Worried that your “friends” and others are filled with envy about your good fortune? The protection of the Nazar is used for anything new or likely to attract praise. The belief is that even well-intentioned compliments include a conscious or unconscious dose of envy and resentment. The bead reflects the evil intent back to the onlooker. It somewhat resembles an eye and it is said the typical blue color is a factor in protecting the user.
A great team of people, showed with endless enthousiasm to many, many people could convince themselves of how simple it actually is to pack products like the Nazar Boncuğu amulet in a cold sealing blisterpackage. The Ecobliss jiggle roller was used to show the cold sealing packaging technology. The blistercard and blisters to pack the amulet where especially designed for the 2009 packaging exhibition. Approximately 15.000 Nazar Boncuğu amulets where packed and handed out at the exhibition…That’s a lot of protection against evil eyes!!!
Besides cold seal blisterpackaging, Ecobliss also introduced the programm of Starview heatsealing equipment, combined with perfectly sealing heat-seal blistercards. three different Starview machines where displayed at the show, and a lot of interest was shown by the Turkish audience, and a number of machines where sold at the show.
Istanbul Packaging Fair 2009 held from 22-25 October 2009
Visit Ecobliss Blisterproducts Ambalaj – Hall 8 – stand # 812.
ISTANBUL; THE CENTER OF PACKAGING IN EURASIA Istanbul Packaging 2009, 15th Istanbul Packaging Industry Fairwill be organized by Tüyap Fairs and Exhibitions Organization Inc. between the dates October 22 – 25, 2009 at TÜYAP Istanbul Fair, Convention and Congress Center – Büyükçekmece.
Istanbul Packaging Industry Fairwill is an active member of Global Association of the Exhibition Industry (UFI) and Confederation of Organisers of Packaging Exhibitions (COPE).
One of the major indicators of growth of the Turkish economy is the rapid development of the packaging industry during this process. Held on an area of a thousand square meters with the participation of 30 firms in 1994, the Packaging Industry Fair hosts this year 1227 firm and firm representatives from 40 countries, on an area of 60 thousand square meters, being the largest annual packaging fair of Europe.
Having grown nearly twenty-fold since 1994, the first year it was held and 34.782 visitors have visited the Packaging Industry Fair this year.
The Packaging Industry Fair also host the Packaging Design National Student Contest to held with the purpose of encouraging project development by Turkish design students in the area of packaging design and increasing the interest of designers and future designers in the packaging industry. The winning prizes of the Packaging Design National Student Contest, which held for the fifth time next year through the cooperation of TÜYAP, exhibit at TÜYAP throughout the fair.
FachPack 2009 held in Nuremberg Germany from 29th September – 1st October !
FachPack will be 30 in 2009!
One of Europe’s top events when it comes to the variety of innovative packaging supplies and highly specialized packaging machinery celebrates its birthday. And you are cordially invited. Present your products, solutions and services exactly where the demand is: to the good 34,000 experts from Germany, Austria, Switzerland, the Benelux countries, Italy, France and the growth markets of Central Eastern Europe. For the interest of decision-makers looking for solutions that save resources and improve efficiency is concentrated in Nuremberg, especially in the 30th anniversary year. A special show on these themes provides varied food for thought.
The strengths of the combined exhibition with LogIntern, the Trade Fair for In-Plant Logistics, and PrintPack, the Trade Fair for Package Printing and Packaging Supplies Production, take full effect in the 30th year of FachPack: intensive personal dialogue with excellently prepared trade visitors and the unique opportunity for cooperations or technology partnerships as part of the complete packaging process chain. So be there when FachPack celebrates its birthday! Profit from new contacts and productive talks on your stand. Solutions developed here lead to fi rm orders after the exhibition. Look forward to an inspiring atmosphere and promising business – at FachPack 2009.
The product package decisively influences the decision to buy. This is nothing new, but at times of rising competitive pressure and fluctuating economic forecasts it is even more important to adopt new approaches and show the way. So gather information about efficient, cost-effective solutions that help you present your products perfectly and make them stand out more from the competition – at FachPack 2009 in Nuremberg.
Rely on the experience of a good 1,300 exhibitors, who over the last three decades have made FachPack what it is today: one of Europe’s top events when it comes to innovative packaging solutions. Use the latest machinery to give your products that certain something – with unusual packaging and design materials that also provide the best possible protection. FachPack in combination with PrintPack and LogIntern offers you maximum information and opportunities for contact.
Find a well-packed solution for your company – at FachPack 2009 in Nuremberg!
IPACK-IMA 2009, Think Big!
IPACK-IMA 2009, Processing, Packaging and Material Handling – FIERAMILANO, RHO – MILAN – ITALY – 24-28 MARCH 2009
Integration is here
IPACK-IMA’s objective is to bring together the supply and demand of the processing and packaging technology industries. IPACK-IMA is where suppliers of food and non-food technology and trade buyers do business, exchange ideas and opinions and form alliances creating one of the most influential communities on the worldwide scene.
First held in 1961, IPACK-IMA has never stopped growing around its pivotal point: integration.
How? By linking the different stages of industrial activity and helping to make this relationship as smooth and effective as possible.
Today IPACK-IMA is a system exhibition, showcasing integrated solutions for product handling, from processing to packaging, up to the point of sale.
Statistics prove it beyond doubt: the 2006 edition registered 1,527 exhibitors.
Italy has a primary role on the worldwide packaging scene and IPACK-IMA is the natural showcase for “made in Italy” products.
IPACK-IMA is more and more growing as an international event: 1 in 4 exhibitors come from a company outside Italy. However, there is one thing all exhibitors have in common no matter where they come from: satisfaction with IPACK-IMA. 82% of exhibitors were satisfied with the last edition.
Ipack-Ima Download brochure
Logistica 2009, International Trade Fair on Material Handling Held from 10-14 November 2009
Logistica 2009 held from 10-14 November in the Jaarbeurs Utrecht, The Netherlands.
Visitors of Logistica originate from the following branches:
• Transport, storage, communication
• Wholesale/ intermediate trade
• Food and stimulants industry
• Metal products industry
• Public enterprise
• Machinery industry
• Chemical industry
• Other industry
• Business services
Logistica would not be the same without the related and aptly named Scala Logistica – a full spectrum of logistics genius. Scala Logistica 2009 – a range of live show demonstrations – will be the ninth edition of a successful new solution concept. It will offer suppliers of logistics products and services the opportunity to spotlight the ‘State-of-the-Art in Logistics’ – in the most literal meaning of the word.
Kunststoffen 2009, Veldhoven Nederland, 23 en 24 september
Op 23 en 24 september is het weer zover, het Mikrocentrum organiseert voor de 11e keer de Kunststoffenbeurs. Kunststoffen 2009 is een brede vakbeurs, ruim 200 gespecialiseerde exposanten, gecombineert met een uitgebreid congresprogramma. Het thema van dit gratis toegankelijke evenement is dit jaar “Presteren door Innoveren”.
Woensdag 23 en donderdag 24 september 2009 Openingstijden: 09.30 tot 17.00 uur
Review Emballage 2008 Paris, France.
At the 38th Emballage Ecobliss displayed all types of blister and high visibility packaging including the Stock Clamshell Blisters and Stock PET Boxes.
The Emballage World Packaging Exhibition is a biannual event in the exhibition centre Paris Nord-Villepinte Parijs. This international exhibition in the world capital of creation, trends and packaging design offers a complete and international overview of packaging, equipment and development. As with previous editions the IPA World Food Process Exhibition 2008 was held at the same place and time. Be aware that Ecobliss offers packaging solutions for food as well.
Award won for technology at IndiaPack 2008
First prize winner in category "Technology in Packaging Industry"
Ecobliss was present at the International Packaging show IndiaPack 2008 which was held 18 – 21 September.
This show was held in Mumbai. All types of blisters and high visibility packaging Ecobliss offers, including the Stock Clamshell Blisters, were on display. The newest development, Stock PET Boxes and Printed PET Boxes, were also on display and drew a lot of attention.
The Ecobliss display has evoked great response in the user community.
The Ecobliss packaging has proven to be an internationally acclaimed, genuine, Eco friendly packaging concept.
Mr. Keith Pierson (President of the World Packaging Organisation) has given away “the award for BEST Packaging Technology” (first prize) and commended the innovation and originality of the Ecobliss packaging concept.
We have added some impressions of the Ecobliss booth at the Indiapack.
 |
 |
 |
 |
 |
 |
 |
 |
September 2008 – Impressions of Taropak 2008
Ecobliss was present at the International Packaging Technology and Logistics Exhibition Taropak 2008 which was held 15 – 18 September.
The show was held in Poznan, Poland and is the largest trade show for the packaging and logistic industry in Central and Eastern Europe. A selection of all types of blisters and high visibility packaging Ecobliss offers, including the Stock Clamshell Blisters and the newest development Stock PET Boxes and Printed PET Boxes, were on display.
We have added some impressions of the Ecobliss booth at the Taropak.
 |
 |
 |
Impressions of Interpack 2008
Ecobliss was present full force at the International Packaging show Interpack 2008 which was held 24 – 30 April.
This very large and well known packaging exhibition took place in Düsseldorf, Germany. All types of blisters and high visibility packaging Ecobliss offers, including the Stock Clamshell Blisters, were on display. The newest development, Stock PET Boxes and Printed PET Boxes, were also on display and drew a lot of attention.
Many visitors took one of the eight language versions of the new Ecobliss brochure to have a summary of all Ecobliss products and services at hand. With the new 32 page brochure, the many different product samples and a few additions to the exhibition booth the full range of Ecobliss promotion material is now complete.
We have added some impressions of the Ecobliss booth at the Interpack.
Impressions of Fachpack 2007
Ecobliss was present at Fackpack 2007 which was held on September 25, 26, 27.
This annual packaging exhibition takes place in Nuremberg, Germany. All types of blisters and high visibility packaging Ecobliss offers were on display.
The newest development within Ecobliss, the Ecobliss Stock Blister, for which the Webshop went online on July 5th, drew a lot of attention and resulted in new webshop orders just days after the exhibition! We have added some impressions of the Ecobliss booth at Fachpack.
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |